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生益S1000-2材料规格参数

特点
● 无铅兼容FR-4.0板材
● 高Tg170℃(DSC),UV Blocking/AOI兼容
● 高耐热性
● 低的Z轴热膨胀系数
● 优良的通孔可靠性
● 优异的Anti-CAF性能
● 低吸水率


应用领域
● 广泛应用于计算机与通讯设备,工业控制用高档仪器仪表、路由器等


                                                                                                                                                 材料参数

ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC180
IPC-TM-650 2.4.24.4
DMA

185
TdIPC-TM-650 2.4.24.65% wt. loss345
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃45
After Tgppm/℃220
50-260℃%2.8
T260IPC-TM-650 2.4.24.1TMAmin60
T288IPC-TM-650 2.4.24.1TMAmin20
T300IPC-TM-650 2.4.24.1
TMAmin5
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--100S  No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.2 x 108
E-24/125MΩ.cm4.5 x 106
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance7.9 x 107
E-24/1251.7 x 106
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s100
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV63
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.8
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.013
IEC 61189-2-72110GHz--
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.38
125℃N/mm1.07
Flexural StrengthLWIPC-TM-650 2.4.4AMPa562
CWIPC-TM-650 2.4.4AMPa518
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.10
CTIIEC60112ARatingPLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

 

 

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