邮箱: sales@ipcb.cn | 电话: 0755-23200081 | English

专注精密PCB电路板研发生产厂家

微波·高频·陶瓷·电路板·HDI·软硬结合·多层PCB线路板

生益S1130材料规格参数表
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC135
TdIPC-TM-650 2.4.24.65% wt. loss310
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃65
After Tgppm/℃310
50-260℃%4.5
T260IPC-TM-650 2.4.24.1TMAmin13
T288IPC-TM-650 2.4.24.1TMAmin<1
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--60S  No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm4.8E + 08
E-24/125MΩ.cm4.6E + 06
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance5.2E + 07
E-24/1255.3E + 06
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s120
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV60
Electrical StrengthIPC-TM-650 2.5.6.2D-48/50+D-4/23kV/mm
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.6
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.016
IEC 61189-2-72110GHz--
Peel Strength(1oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.8
125℃N/mm1.6
Flexural StrengthLWIPC-TM-650 2.4.4AMPa600
CWIPC-TM-650 2.4.4AMPa500
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.15
CTIIEC30112C-48/23/50,PLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

 

分享到: