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微波电路板·高频板·高速电路板·双面多层板·HDI电路板·软硬结合板
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特点
● 电子级玻璃纤维布增强无机陶瓷填料和碳氢类树脂复合介质材料
● 具有优异的低介电常数和介电损耗等高频性能
● 不同频率下稳定的介电性能
● 低的Z轴膨胀系数，优异的尺寸稳定性
应用领域
● 微带和蜂窝基站
● 功率放大器
● 天线
● LNA/LNB
● 高频无线通讯
● 卫星信号传输设备
材料参数
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Dielectric Constant Process Dk | IPC-TM-650 2.5.5.5 [1] | 10GHz/23℃ | - | 3.42±0.05 |
| Dielectric Constant Design Dk | Differential phase length test | A | - | 3.61 |
| Dielectric Constant | ICE 61189-2-721 (SPDR) | 10GHz/23℃ | - | 3.68±0.05 |
| Loss Tangent | IPC-TM-650 2.5.5.5 | 10GHz/23℃ | - | 0.0030 |
| IEC 61189-2-721 (SPDR) | 10GHz/23℃ | - | 0.0035 | |
| TcDk | IEC 61189-2-721 | 10GHz (-40-150℃) | ppm/℃ | +50 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | A | MΩ·cm | 1.1 x 108 |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | A | MΩ | 1.6 x 107 |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | ＞280 |
| Td | ASTM D3850 | TGA (5% W.L) | ℃ | 390 |
| CTE (X/Y/Z-axis) | IPC-TM-650 2.4.24 | TMA (30-260℃) | ppm/℃ | 12/14/45 |
| Peel Strength | IPC-TM-650 2.4.8 | 288℃/10s | N/mm [ln/in] | 0.72 [4.11] |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/34 | % | 0.06 |
| Thermal Conductivity | ASTM D5470 | 100℃ | W/m·K | 0.66 |
| Tensile Modulus (LW/CW) | ASTM D638 | A | GPa | 16.1/18.5 |
| Tensile Strength (LW/CW) | ASTM D638 | A | MPa | 175/245 |
| Flexural Strength | IPC-TM-650 2.4.4 | A | MPa | 260 |
| Flammability | UL-94 | C-48/23/50 | Rating | V-0 |
