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微波·高频·陶瓷·电路板·HDI·软硬结合·多层PCB线路板

S7136H材料规格参数

特点
● 电子级玻璃纤维布增强无机陶瓷填料和碳氢类树脂复合介质材料
● 具有优异的低介电常数和介电损耗等高频性能
● 不同频率下稳定的介电性能
● 低的Z轴膨胀系数,优异的尺寸稳定性

应用领域
● 微带和蜂窝基站
● 功率放大器
● 天线
● LNA/LNB
● 高频无线通讯
● 卫星信号传输设备


                                                                                                                              材料参数

ItemsMethodConditionUnitTypical Value
Dielectric Constant
Process Dk
IPC-TM-650 2.5.5.5 [1]10GHz/23℃-3.42±0.05
Dielectric Constant
Design Dk
Differential phase length testA-3.61
Dielectric ConstantICE 61189-2-721 (SPDR)10GHz/23℃-3.68±0.05
Loss TangentIPC-TM-650 2.5.5.510GHz/23℃-0.0030
IEC 61189-2-721 (SPDR)10GHz/23℃-0.0035
TcDkIEC 61189-2-72110GHz (-40-150℃)ppm/℃+50
Volume ResistivityIPC-TM-650 2.5.17.1AMΩ·cm1.1 x 108
Surface Resistivity
IPC-TM-650 2.5.17.1
A1.6 x 107
TgIPC-TM-650 2.4.25DSC>280
TdASTM D3850TGA (5% W.L)390
CTE (X/Y/Z-axis)IPC-TM-650 2.4.24TMA (30-260℃)ppm/℃12/14/45
Peel Strength
IPC-TM-650 2.4.8288℃/10sN/mm [ln/in]0.72 [4.11]
Water AbsorptionIPC-TM-650 2.6.2.1D-24/34%0.06
Thermal ConductivityASTM D5470100℃W/m·K0.66
Tensile Modulus (LW/CW)ASTM D638AGPa
16.1/18.5
Tensile Strength (LW/CW)ASTM D638AMPa175/245
Flexural StrengthIPC-TM-650 2.4.4AMPa260
Flammability
UL-94C-48/23/50RatingV-0


 

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