KB-6167F，高TG无铅环氧覆铜板采用优质玻璃纤维布及环氧树脂经特别工艺压制而成，拥有较高的TG值,TG170可使它在更加高的温度中工作．

特性：

● Tg 170(DSC 测试),低Z轴 CTE值  Tg 170℃ (DSC Testing),low Z-axis expansion

● 相容紫外光阻挡及光学自动检查功能,可提高PCB生产效率与准确性 UV Blocking and AOI (automatic optical inspection) compatible， so as to increase
productivity and accuracy

● 热裂解温度高 High Thermal Delamination
● 优良的耐热性,能满足无铅制程要求 Excellent heat resistance and appropriate for lead-free assembly

● 符合IPC-4101B的规范要求 IPC-4101B specification is applicable

应用领域：

●计算机及外围设备  Computer and peripheral

●通讯设备 Communication equipment

●仪器仪表 instrument

●办公自动设备 OA equipment,etc

                    板材能性表