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生益S1141 FR4板材
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC140
TdIPC-TM-650 2.4.24.65% wt. loss310
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃65
After Tgppm/℃300
50-260℃%4.5
T260IPC-TM-650 2.4.24.1TMAmin15
T288IPC-TM-650 2.4.24.1TMAmin2
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--60S  No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm5.2E + 08
E-24/125MΩ.cm5.2E + 06
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance5.4E + 07
E-24/1255.6E + 06
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s120
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV60
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.6
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.015
IEC 61189-2-72110GHz--
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.8
125℃N/mm1.6
Flexural StrengthLWIPC-TM-650 2.4.4AMPa600
CWIPC-TM-650 2.4.4AMPa500
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.15
CTIIEC60112ARatingPLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0
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