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微波电路板·高频板·高速电路板·双面多层板·HDI电路板·软硬结合板
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特点
● 无铅兼容FR-4.0板材
● 高Tg170℃（DSC）,UV Blocking/AOI兼容
● 高耐热性
● 低的Z轴热膨胀系数
● 优良的通孔可靠性
● 优异的Anti-CAF性能
● 低吸水率
应用领域
● 广泛应用于计算机与通讯设备，工业控制用高档仪器仪表、路由器等
材料参数
| Items | Method | Condition | Unit | Typical Value | |
|---|---|---|---|---|---|
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
| IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 345 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
| After Tg | ppm/℃ | 220 | |||
| 50-260℃ | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 20 | |
| T300 | IPC-TM-650 2.4.24.1 | TMA | min | 5 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 100S No Delamination | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 2.2 x 108 | |
| E-24/125 | MΩ.cm | 4.5 x 106 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 7.9 x 107 | |
| E-24/125 | MΩ | 1.7 x 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 100 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 63 | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.013 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.38 | |||
| 125℃ | N/mm | 1.07 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 562 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 518 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.10 | |
| CTI | IEC60112 | A | Rating | PLC 3 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||
